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TeploTie included in leading U-value calculation software PDF Print

TeploTie, thermally insulating wall ties, have been added to the latest version of U-value calculation software; BuildDesk U. The addition enables users of the software to quickly model the U-value improvement that the low conductivity wall ties can bring to a wall design.

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BuildDesk U is a professional software tool for U-value calculation and Condensation Risk Analysis (CRA). The software allows users to adapt 500 template constructions or to construct bespoke designs by selecting real products from the comprehensive materials catalogue. The clear graphics and print outs ensure that the specifications and build ups are easy to understand.

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The software is available for a free 30 day trial from:
http://www.builddesk.co.uk

 

May 2009

 

 
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